System Overview

Dicing of full wafers up to 8″ and piece-parts. A dicing saw employs a high-speed spindle fitted with an extremely thin diamond blade to dice or groove semiconductor wafers and other work pieces. Saws feature versatile processing capabilities, compact designs, and high precision and reliability. Users perform work-piece loading, alignment, and unloading automatically.

Location: E6-03-02, Metrology

Contact: e6nanofab@nus.edu.sg