System Overview

A procedure used to deposit uniform thin films to flat substrates. Small amount of coating material is applied on the center of the substrate, which is either spinning at low speed or not spinning at all. The substrate is then rotated at high speed in order to spread the coating material by centrifugal force.

Spin coater involves accurately dispensing a liquid onto a flat substrate and then spinning at high speed to achieve a uniform film.

Technical Specifications

• Speeds of up to 6,000 RPM.
• Irregular sizes 5-50 mm
• Handle up to 8” wafers on a vacuum chuck.

Location: E6-01-03, Class 100 Cleanroom

Contact: e6nanofab@nus.edu.sg