The Magnetic Annealing System is an 8.0 Tesla Magnetic Annealing System for pilot line and R&D usage.
Technical Specifications
• Magnetic field: 0 to 8.0 Tesla • Wafer size: Ø2” (51 mm) circular diameter & 5 product wafers • Wafer orientation: In plane or perpendicular to magnetic field direction • Field homogeneity: -2/+2% over product wafers • Field uniformity: Angle <+/-1.5° over product wafers • Set-point accuracy: <5 mTesla • Field stability: <0.1% of field value • Field reproducibility: <5 mTesla • Temperature range: 200 – 450°C • Max wafer exit temp: 60°C • Thermal uniformity: < ±3°C in sample volume • Set point accuracy: ±1.5°C • Cross wafer uniformity: ±2°C • Cross stack uniformity: ±1.5°C