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MASK ALIGNER MA8 (CLASS 100)

System Overview

The mask aligner operates either in contact or in proximity mode and able to handle a wide range of substrate sizes
from small pieces up to 200mm wafers.
 

Available Resource

  • UV and DUV, AZ1512 and AZ4110
  • Masks are not provided


Technical Specifications

  • Able to handle substrate size of 25 mm round up to 200 mm round and
    200 x 200 mm square
  • Capable to handle mask size ranging from 2”x2” up to 9”x9”
  • DC lamps HG 350 W/S, HG 500 W, HG-XE 500 W
  • X, Y, THETA- alignment stage for motorized operation, resolution 0.1um
  • Alignment gap programmable from 1 to 1,000 micron, resolution at 1 micron
  • MO optics for Highest Uniformity, Diffraction reduction, Focus depth increase
  • Substrate Conformal Imprinting Lithography (SCIL) / PDSM Imprinting Lithography
  • Imprint lithography up to 150mm
  • Wavelength: 350 to 1200 nm
  • TSA alignment accuracy: <0.5μm
  • BSA alignment accuracy:<1.0 um
  • Infra-red (IR) Alignment, BSA alignment accuracy ≤ 1µm
  • UV uniformity: +/-3.5% for 8” wafer
  • Patterning of structures resolution below 0.8 μm
  • Alignment accuracy down to 0.25 μm
  • (SCIL) / PDSM Imprinting Lithography resolution better than 100nm

 

Location: E6-01-03, Cleanroom, Class 100

Contact: e6nanofab@nus.edu.sg