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MAGEST S200- MULTI CHAMBER SPUTTERING SYSTEM

Magest S200 is a batch-processing type multi-chamber sputtering system correspond to MRAM  production.

Targets :
Mg, Cu, W, Fe60Co20B20, Fe90Co10, Fe80B20, Co, Pt, Ru, Ta, Ti, MgO

Processing Type :
Magnetic nanofabrication

System Overview

This system consists of Autoloader, Transfer Chamber, Pre-clean Chamber , RTP Chamber & Sputter chamber sections.

      • Autoloader: Dual-arm ROBOT, Alignment station, 2 Stage cassette Interface, metal wafer stocker for 200mm wafer (25 pcs. of wafers capacity)
      • Transfer Chamber: Wafer transfer robot Keytran-IV (KRC-4000Z) Dual arm
      • Pre-clean Chamber: 2 gas Lines (Ar 100sccm, Ar 5 sccm), LT-ICP Electrode and Ceramic Shield.
        • ESC hot plate stage and RF Power supply
      • RTP Chamber: (Ar 2SLM, N2 100sccm, O2 5sccm, Ar 100sccm), Quartz Pin stage, Gold Image Furnace (9zone Lamp) 
      • Sputter Chambers: The system has four sputter chambers with wafer stage rotation. Each sputter chamber has a sputter down mechanism with a permanent magnet rotation magnetron cathode. The sputter chamber can form the continual membrane of maximum of 3 layer loads “triple gun cathode”.
              • Sputter Chamber-1 (DC/RF Sputter): (Ar 100 sccm, Ar 5 sccm),
              • Sputter Chamber-2 (DC Sputter): (Ar 100 sccm, Ar 5 sccm),
              • Sputter Chamber-3 (DC Co-Sputter): (Ar 100 sccm, N2 50 sccm, Ar 5 sccm, Kr 100 sccm), ESC hot plate stage
              • Sputter Chamber-4 (DC/RF Sputter): (Ar 100 sccm, N2 100sccm, Ar 5 sccm),
              • Control System: This system is fully automatically controlled by ULVAC’s CyberCELL, and this software has a flexible design consisting of fore transfer modes: series, parallel, series/parallel and random access. Operation is performed only on a Cluster Tool Controller (CTC) that has operator—friendly-human-interface design
      • Chambers and Targets

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Location:
E6-01-02, Class 100 Cleanroom

Contact: e6nanofab@nus.edu.sg